Component Inspection to an exceptional level
Princeps is committed to providing the highest quality electronic components through a comprehensive inspection process that reflects its dedication to quality. The company employs a meticulous process traceability system, whereby each component is tracked throughout its lifecycle, from the supplier delivery note to customer dispatch.
Princeps conducts high level inspections for component inspection, which includes both in-house laboratory and extended inspection services. When components arrive they undergo thorough checks that include:
- Product Research and PCN Review
- General External Inspection
- Detailed Visual Inspection with High Power 3D Microscopy
- Surface Texture Analysis, Resurfacing and Remarking Inspection
- Radiographical Inspection
- XRF Spectroscopy
- Decapsulation and Internal Inspection
- Additional testing as required such as FT-IR Spectroscopy, Parametric, Scanning Acoustic Microscopy, etc
Meaning that Princeps can confidently guarantee the quality of electronic components.
Inspection Reports
A key part of Princeps' quality assurance includes generating an Inspection Report, which serves as a vital reference for due diligence and risk mitigation. This report details standards, covering counterfeit electronic parts through avoidance, detection and mitigation strategies. It provides a reliable means to verify the authenticity and quality of purchased components.
If required detailed, illustrated reports can be provided to evidence the steps taken to mitigate the counterfeit risk.
Speak to our Laboratory Team about the information contained in our detailed Inspection Reports
Streamlined Supply Chain Solutions
Our range of Supply Chain and Component Sourcing services include:
Traceability
Safe, traceable sourcing of currently available EEE components. Order traceable current parts via a variety of ordering and delivery models including blanket, call off and KANBAN.
Sourcing
Rely on our knowledge & expertise to securely source the parts you need. Secure sourcing for hard-to-find parts including those that are obsolete.
Tail Management
Rationalise a range of suppliers to a single point of contact. Vendor tail reduction for supply chain simplification and giving you a single point of contact for EEE sourcing and procurement.
Kitting
Managed solution including sourcing and traceability. Simplify production with kitting solutions & reduce hidden costs, streamlining manufacturing and addresses counterfeit mitigation.
Inspection of Electronic Components
Inspection of electronic components is a crucial step in the procurement process, ensuring that all items meet necessary quality standards and regulations before reaching your facility. By engaging in thorough examinations, these inspections help to identify defects, prevent counterfeiting and mitigate risks associated with supplier variability. This practice safeguards the integrity of your final products and builds trust in your supply chain.
Choosing Princeps for your component inspections offers several benefits:
- Quality Assurance, as each component is examined
- Risk Mitigation, through authenticity verification and compliance, helping eliminate counterfeit components
- Supplier Evaluation, via regular inspections that provide insights into supplier capabilities
- Peace of mind by knowing that an experienced inspector has vetted your components
By trusting Princeps with your component inspections, you position your business for success in a competitive market.
What are the Various Tests Covered in Princeps Component Inspection Service?
Stage 0: Product Research covers desk research of each component, covering all manufacturer published information, PCNs, material declarations, labelling and documentation expectations. The end result is a bespoke checklist of expected conditions to be confirmed during the inspection.
Stage 1: A thorough visual examination of all material packaging, labels to ensure compliance with the expectations identified during the Stage 0 research.
Stage 2: A detailed visual inspection using high power 3D microscopy to examine the outer condition of a sample of components from each lot. Mircoscopic examination is conducted at magnifications between 10x and 2500x ensuring all defect conditions are identified and documented. Samples are also weighed and dimensions checked against the manufacturer’s published data.
Stage 3: A combination of digital, mechanical and chemical techniques are used to identify any secondary coatings that may have been applied to counterfeit parts. Surface Texture Analysis is also employed to mathematically model the surfaces of a part and quantify the finish, allowing for simple comparison of different surfaces.
Stage 4: A sample of devices from each lot is subjected to controlled radiographic inspection. Our micro-focus x-ray has a focal spot size of 10µm and can produce magnification up to 100x for an in-depth assessment of the internal features of a device which allows us to evaluate individual bond wires on an integrated circuit.
Stage 5: Traditionally X-Ray Fluorescence Spectroscopy or XRF has been used to evaluate RoHS compliance in the electronics industry. Whilst establishing RoHS compliance is an important step in inspecting a device, we use XRF for much more. It enables us, on an elemental basis, to identify the composition of a device and compare with the manufacturers published material declaration.
Stage 6: Internal visual inspection is a destructive method that allows us to look inside the device. Plastic encapsulated microcircuits are opened using hot acid to dissolve the plastic, this is undertaken using a specialist sealed unit. A successful decapsulation will result in a still operational device with the internal circuitry exposed for inspection. Component bond wires, the silicon die, bond pads and leadframe can be evaluated visually using high power microscopy and the internal features of the part further analysed with XRF if necessary.
Stage 7: Additional stages of testing can be undertaken if required, some of the more common tests include:
- Fourier Transform Infra Red Spectroscopy – a method especially suited to evaluating the polymers and plastics used in the manufacture of integrated circuits
- C Mode Acoustic Microscopy – a method to identify prior use of parts by identifying delamination between internal surfaces of an integrated circuits amongst other indicators
- Parametric Testing – electrical testing of samples to compare with the expected performance in accordance with the manufacturers published data or other exemplars